Electrical Bonding
/ ɪˌlɛktrɪkəl ˈbɒndɪŋ /
Also known as: equipotential bonding, main bonding, supplementary bonding, protective bonding
Definition
Electrical bonding is the connection of metallic pipework, structural steelwork, and other extraneous conductive parts to the installation's earthing system, equalising their potentials so no dangerous voltage can appear between items of metalwork. Main equipotential bonding connects incoming gas and water pipes to earth near the consumer unit using 10mm2 green-and-yellow cable, with accessible clamp connections labelled "Safety Electrical Connection - Do Not Remove". Supplementary bonding connects metalwork within a specific room (such as a bathroom) - though this is no longer required under BS 7671:2018 (18th Edition) where all bathroom circuits have 30mA RCD protection. Bonding does not prevent faults; it limits dangerous potential differences during fault conditions.
In practice
Main bonding connections are frequently found under the kitchen sink (on the water pipe) and on the gas pipe near the meter, usually clipped to the pipe with a purpose-made bonding clamp. The bonding conductor runs back to the main earthing terminal (MET) in or near the consumer unit. A common installation defect is the bonding connection being made downstream of a plastic section inserted into the pipework - if the plastic break interrupts the metallic continuity, the bonding clamp downstream of the break does not bond the pipework serving the rest of the installation. The clamp must always be on the metal pipework closest to the entry point, on the upstream (incoming) side of any plastic section.
When a plumber replaces metal pipework with plastic push-fit pipe, they may not realise that inserting plastic into the previously-bonded metal pipe breaks the bonding continuity. This is a notifiable change under Part P of the Building Regulations in England and Wales and should be notified to or certified by a qualified electrician. An EICR (Electrical Installation Condition Report) inspection will identify missing or defective bonding as a C2 (potentially dangerous) defect requiring urgent remediation.
See also